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  • Fluxless Sn-Ag Solder Joints Between Silicon and Ag-Cladded . . . - IPC
    A fluxless bonding process between silicon and copper using Sn-rich Ag-Sn-Au multilayer composite has been developed The copper substrate is plated with a silver layer as stress buffer We bond 5mm x 5mm silicon chips onto Ag copper substrates using electroplated lead-free Ag-Sn-Au solder
  • Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder . . .
    Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging
  • 5. 2 Eutectic Pb-Sn Phase Diagram and Microstructures
    The single-phase, beta, Sn-rich region bounded by the beta phase solubility limit line (solvus) of Pb in the Sn-rich beta phase The line that bounds the beta phase region with the maximum solubility of Pb in Sn-rich beta at equilibrium The composition at which the eutectic reaction occurs
  • Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb . . . - NASA
    High purity bright Sn, Sn–Cu and Sn–Pb layers, 3, 7 and 16 lm thick were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus Beam deflection measurements within 15 min of plating proved that all electrodeposits had in-plane compressive stress
  • Composition analysis and transition energies of ultrathin Sn-rich GeSn . . .
    the aim of creating Sn-rich quantum well (QW) and multi-ple quantum well (MQW) structures rather than superlattice structures The Sn thickness was kept close to the critical layer thickness for the onset of 3D island growth, deter-mined to be 2 25 MLs at a substrate temperature of 100°C In all of these growth experiments, Sn segregation across
  • The influence of Sn content on the electrochemical performance and . . .
    The energy density of the aluminum anode is influenced by two factors: the capacity density and the average voltage of the aluminum anode The presence of the rich Sn phase results in a reduction in corrosion resistance but an increase in its discharge activity The average voltage of Alloy 4 (0 05% Sn) aluminum anode reaches a maximum of 1 548 V
  • A Wafer-Level Sn-Rich Au–Sn Bonding Technique and Its Application in . . .
    The Sn-rich Au–Sn solder bonding provides a reliable, low-cost, low-temperature and wafer-level hermetic packaging solution for the micro-electromechanical system devices and has potential applications in high-end biomedical sensors
  • Strengthening Analysis of Ni-Sn Alloy Layer by Double Alloying . . . - MDPI
    It can be observed that an Sn-rich alloy layer with a thickness of approximately 2 μm is formed on the surface of the Ni substrate after irradiation The entire alloy layer is uniform, smooth, and compact, and metallurgical bonding with the substrate occurs
  • Effect of Sn content on the mechanical properties and corrosion . . .
    The results showed that when the Sn content was 1 4 wt%, Sn dissolved in the α-Mg matrix and then precipitated as an intermetallic compound(Mg2Sn ) The combined results of mass loss, hydrogen evolution, and electrochemical measurements indicated that Mg-3Al-1Sn had a low corrosion rate





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