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  • Assembly guidelines for land grid array (LGA) package - NXP Semiconductors
    NXP offers industry standard LGA sizes and thicknesses with various options of input output quantity and pitch Package sizes range from 2 × 2 mm to 27 × 27 mm, with ball pitch ranging from 0 4 mm to 1 27 mm Refer to NXP package case outline drawings to obtain detailed dimensions and tolerances
  • Land grid array - Wikipedia
    Unlike the pin grid array (PGA) interface found on older AMD and Intel processors, there are no pins on the chip; in place of the pins are pads of bare gold-plated copper that touch protruding pins on the microprocessor's socket on the motherboard
  • Guidelines for design and board assembly of land grid array packages . . .
    There are typically two types of pad designs for the LGA package as shown below in Figure 6 and Figure 7 The SMD pads have a solder mask opening smaller than the Cu pad while a SSMD has a solder mask covering only the three sides of the Cu pad
  • Assembly Considerations for Analog Devices µModule LGA BGA Packages
    the LGA pads (pads are solder mask defined) Adjustments to the setup on placement systems are done using force as a variable or Z height from the PCB as reference
  • LGA: A Flexible and Reliable Surface-Mount Packaging Technology for . . .
    LGA (Land Grid Array) packages have exposed metal pads on the bottom surface that directly connect to the PCB, while BGA (Ball Grid Array) packages have an array of solder balls that melt during the reflow process to establish a connection with the PCB
  • LGA - Land Grid Array
    The Land Grid Array, or LGA, is a package that uses metal pads for external electrical connection instead of leads (as in the pin grid array) or solder balls (as in the ball grid array) These metal pads, which are called 'lands', are arranged in a grid or array at the bottom of the package body, hence the name 'land grid array'
  • Find all TI packages - Texas Instruments
    Land Grid Array (LGA) is a laminate substrate-based package that uses metal pads for external electrical connection instead of solder balls (as in the ball grid array) These metal pads, which are called 'lands', are arranged in a grid or array at the bottom of the package body
  • Package Application Note for LGA Packages - Microchip Technology
    LGA packages are plastic encapsulated laminate-based packages similar to the BGA type pack-ages, but without the solder balls Bottom termi-nals are used to connect the LGA package to the application PCB via solder material
  • Soldering Guidelines for Land Grid Array Packages - pSemi
    Users have the option to either use solder mask defined (SMD) pads or non-solder mask defined (NSMD) pads High temperature FR-4 or BT laminate (glass transition temperature Tg = +170 °C to +185 °C) is generally recommended for lead-free LGA assembly
  • Reliable PCB Assembly of Land Grid Array Packages in Planar . . . - Analog
    High frequency planar phased arrays often require a complexity from their beamforming ICs and transmit receive (T R) modules that force the devices into high pin-count land grid array (LGA) packages, so that all the RF circuits fit into a λ 2 lattice spacing LGA packages have recessed pins located on their bottom side





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